PHOTOSENSITIVE RESIN COMPOSITION, AND COATING FILM, RESIST INK, RESIST, SOLDER RESIST AND PRINTED CIRCUIT BOARD EACH PRODUCED THEREFROM

摘要

A dilute-alkali-developable photosensitive resin composition which does not become sticky even by contact exposure in a short precuring time and has a wide allowable range of precuring time. The composition comprises: (A) an ultraviolet-curing resin having a weight-average molecular weight of 6.000 to 30.000 and prepared by the reaction of a polymer composed of (a) 60 - 100 mole % of glycidyl (meth)acrylate and (b) 40 - 0 mole % of another ethylenic monomer copolymerizable with the (meth)acrylate with (meth)acrylic acid and an (un)saturated polybasic acid anhydride in an equivalent of 0.7 to 1.2 per unit epoxy equivalent of the polymer, (B) a photopolymerization initiator, (C) a diluent, and (D) a thermosetting component.