PHOTOSENSITIVE RESIN COMPOSITION, AND COATING FILM, RESIST INK, RESIST, SOLDER RESIST AND PRINTED CIRCUIT BOARD EACH PRODUCED THEREFROM

摘要

Provided are a dilute-alkali-developable, photosensitive resin composition which is not sticky even in contact exposure to be conducted within a short period of pre-curing time and which has a lot of latitude in pre-curing time, and a film to be produced by coating the composition on a substrate followed by curing it. Also provided are a resist ink, a resist and a printed circuit board produced by using composition.;The photosensitive resin composition comprises;A. an ultraviolet-curable resin having a weight-average molecular weight of from 6,000 to 30,000, which is obtained by reacting a polymer comprising (a) from 60 to 100 mol% of glycidyl (meth)acrylate and (b) from 0 to 40 mol% of other ethylenically unsaturated monomer(s) copolymerizable with (a), with from 0.7 to 1.2 chemical equivalents, relative to one epoxy equivalent of the polymer, of (meth)acrylic acid and with a saturated or unsaturated, polybasic acid anhydride,B. a photo-polymerization initiator,C. a diluent, andD. a thermo-setting component.