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Surge Dielectric Strength between Printed Circuit Board Conductive Foils with Solder Resist Coating.

机译：用阻焊涂层印刷电路板导电箔之间的浪涌介电强度。

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Yoshiyuki NAGASHIMA; Junpei BABA; Katsuhiko SYUTOH; Eisuke MASADA;
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年度 2002
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1. Anisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boards [J] . Kim Do-Hyoung, Joo Sung-Jun, Kwak Dong-Ok, Journal of Micromechanics and Microengineering . 2015,第10期

机译：铜图案/可光成像阻焊剂复合材料的各向异性粘弹性壳建模技术，用于多层印刷电路板的翘曲仿真
2. Equivalent Capacitance Approach to Calculate Effective Roughness Dielectric Parameters for Copper Foils on Printed Circuit Boards [J] . Marina Y. Koledintseva, Tracey Vincent International Journal of Microcircuits & Electronic Packaging . 2018,第2期

机译：等效电容法计算印刷电路板上铜箔的有效粗糙度介电参数
3. Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly [J] . Hung-Jen Chang, Jung-Hua Chou, Tao-Chih Chang, Journal of Electronic Packaging . 2011,第2期

机译：金属间特性对无卤印刷电路板组件焊点强度的影响
4. Surge dielectric strength between printed circuit board conductive foil [C] . Shigehiro Yanase, Rie Okada, Katsuhiko Shutoh, 電気学会全国大会 . 2001

机译：印刷电路板导电箔之间的浪涌介电强度
5. Reliability Assessment of Solder Joint Using BGA Package: Megtron 6 Versus FR4 Printed Circuit Boards Using Drop Testing [D] . Mundhe, Pradnya 2017

机译：使用BGA封装的焊点可靠性评估：Megtron 6与FR4印刷电路板的跌落测试
6. Towards Practical Application of Paper based Printed Circuits: Capillarity Effectively Enhances Conductivity of the Thermoplastic Electrically Conductive Adhesives [O] . Haoyi Wu, Sum Wai Chiang, Wei Lin, -1

机译：走向纸基印刷电路的实际应用：毛细作用可有效增强热塑性导电胶的导电性
7. Resolution and Adhesion Properties of Solder Resist for Printed Circuit Board [O] . Sung-Ho Chol, Seong-Jin Hwang, Hyung-Sun Kim 2007

机译：印刷电路板焊料抗蚀剂的分辨率和粘附性能
8. THE EFFECTS OF DIP SOLDERING UPON VARIOUS BOARD MATERIALS AND SOLDER RESIST USED IN PRINTED CIRCUITS [R] . ROBERT P. HOGAN, BERNARD STEPANSKI 1963

机译：DIp焊接对印刷电路中各种板材和抗焊剂的影响

Surge Dielectric Strength between Printed Circuit Board Conductive Foils with Solder Resist Coating.

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