Foreign body analysis apparatus and semiconductor manufacturing control apparatus or foreign body analysis method and semiconductor manufacturing control method

摘要

There is provided a foreign matter analyzing apparatus which can quickly analyze a large number of foreign objects without requiring a highly skilled judgment of an analyst. A scanning electron microscope (SEM) for obtaining a composition ratio for each element with respect to a plurality of foreign substances adhered to a semiconductor wafer, a foreign matter plotting section for obtaining a distribution of foreign matter for each composition ratio on the basis of the analysis result of the SEM (2) A foreign object classification processing section for classifying a plurality of foreign objects on the basis of the distribution of the foreign object classification result and a foreign object specification processing section 12 for specifying the kind of foreign objects by comparing the contents of the foreign object classification result with the contents of a previously set foreign object database.