首页>
外国专利>
Apparatus and method for analyzing foreign matter on semiconductor wafers and for controlling the manufacturing process of semiconductor devices
Apparatus and method for analyzing foreign matter on semiconductor wafers and for controlling the manufacturing process of semiconductor devices
展开▼
机译:用于分析半导体晶片上的异物并控制半导体器件的制造过程的设备和方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A device for analyzing foreign matter on semiconductor wafers is provided, which is capable of analyzing a great deal of foreign matter rapidly without requiring the higher level decision capabilities of a skilled analyst. The device for analyzing foreign matter on semiconductor wafers includes a scanning electron microscope (SEM) which obtains the composition ratios of each element of a plurality of foreign matter adhered to semiconductor wafers. A foreign matter plotting section is provided to obtain the distribution of the composition ratios of the plurality of foreign matter on the basis of a result obtained by the SEM. A foreign matter classifying process section classifies the plurality of foreign matter on the basis of the distribution. A foreign matter identifying process section compares the foreign matter classification result with data stored in advance in a foreign matter data base, thereby identifying the foreign matter type.
展开▼