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Method and apparatus for the removal of surface damage in semiconductors - materials by means of plasma - etching
Method and apparatus for the removal of surface damage in semiconductors - materials by means of plasma - etching
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机译:用等离子体刻蚀去除半导体材料表面损伤的方法和装置
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摘要
A high pressure plasma is used in conjunction with a plasma assisted chemical etching material removal tool 10 to rapidly remove subsurface damage from a substrate without mechanically contacting the surface and without introducing new microscopic or atomic damage to the substrate. IMAGE
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