首页> 外国专利> MASK FOR CONTROLLING CREAM SOLDER PRINTING PROCESS, SUBSTRATE MOUNTING CREAM SOLDER PRINTING MASK AND CONTROLLING METHOD FOR CREAM SOLDER PRINTING PROCESS USING THESE MASK

MASK FOR CONTROLLING CREAM SOLDER PRINTING PROCESS, SUBSTRATE MOUNTING CREAM SOLDER PRINTING MASK AND CONTROLLING METHOD FOR CREAM SOLDER PRINTING PROCESS USING THESE MASK

机译:用于控制锡膏印刷过程的掩模,基体安装的锡膏印刷掩模以及使用这些掩模的用于锡膏印刷过程的控制方法

摘要

PROBLEM TO BE SOLVED: To effectively control for optimum squeegee pressing of substrate mounting cream solder printing. ;SOLUTION: As a part of a cream solder printing mask for a product substrate or as another mask 1, both a small pattern part 2 having pitch and width respectively smaller than the minimum pitch and the minimum width of a pattern for soldering parts on the product substrate and a large pattern part 4 having pitch and width respectively larger than the maximum pitch and the maximum width of the pattern for soldering the same parts are provided. Trial printing is performed by changing squeegee pressing. A squeegee pressing range is obtained in which good printing quality is obtained together in the large and small both pattern parts 2, 4. Furthermore, squeegee pressing is set in the center of the obtained range or in the vicinity of the center or in a point slightly shifted from the center in the reverse direction for the deterioration direction corresponding to the following use and cream solder printing is practically performed. Thereby, the best printing quality is obtained in the conditions at a point of time thereof regardless of a factor such as hardness, the shape and he angle of the squeegee and the kind of cream solder.;COPYRIGHT: (C)1997,JPO
机译:要解决的问题:有效地控制刮板对基板安装膏状焊料印刷的最佳挤压。 ;解决方案:作为产品基板的膏状焊料印刷掩模的一部分或作为另一个掩模1,小图案部分2的间距和宽度分别小于用于在其上焊接部件的图案的最小间距和最小宽度。提供产品基板和大的图案部分4,其间距和宽度分别大于用于焊接相同部分的图案的最大间距和最大宽度。通过改变刮板压力进行试印。获得刮板压制范围,其中在大和小的两个图案部分2、4中一起获得良好的印刷质量。此外,将刮板压制设置在所获得的范围的中心或中心附近或点处。在与劣化方向相对应的相反方向上,从中心沿相反方向稍微偏移一点,从而实际进行膏状焊料印刷。从而,在任何时间条件下都可获得最佳的印刷质量,而不受诸如硬度,刮刀的形状和角度以及膏状焊料的种类等因素的影响。;版权所有:(C)1997,日本特许厅

著录项

  • 公开/公告号JPH09272271A

    专利类型

  • 公开/公告日1997-10-21

    原文格式PDF

  • 申请/专利权人 FUJI PHOTO FILM CO LTD;

    申请/专利号JP19960082292

  • 发明设计人 HOSHI KENICHI;

    申请日1996-04-04

  • 分类号B41N1/24;B41F15/08;B41F15/36;B41F15/40;H05K3/12;H05K3/34;

  • 国家 JP

  • 入库时间 2022-08-22 03:35:57

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