SOLDER CREAM PRINTING MASK AND SOLDER CREAM PRINTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a solder cream printing mask and a solder cream printing method using the mask in which printing can be completed by printing only once and printing can be carried out in a good manner even on an open section in the vicinity of a semiconductor chip when solder cream is printed on a printed wiring board with the semiconductor mounted thereon. ;SOLUTION: A printed wiring board 10 with a semiconductor chip 11 mounted thereon is provided, and a mask 20 with a film 22 having the flexibility for opening and blocking an opening and stuck on a semiconductor chip section is provided, and the mask 20 is bonded on the base 10, and a semiconductor chip section 13 is coated by the expansion and contraction of the film 22, and solder cream 27 is applied on a soldering section of the base 10 by using a sqeegee 26 with a number of slits through an opening 17 of the mask 20.;COPYRIGHT: (C)1998,JPO