Finite element analysis of printing wiring board due to the solder masking process warpage

摘要

Efforts have been made to look at the various processes a printed wiring board (PWB) undergoes during its production, such as lamination, solder masking, and soldering, to determine their impact on board warpage. The focus of this research is on the influence of solder masking process on the PWB warpage. Finite element techniques were used to examine two areas related to solder mask and its application process. The first area studied was sensitivity of board warpage to changes in the mask material properties. The second area studied involved two steps used in applying the mask to the PWBs: curtain coating and curing. Results of these analyses have resulted in general guidelines that should be observed when selecting a mask material and application method.