首页> 外文OA文献 >Effect of Heterogeneity of Laminated Structure in FR-4 on Thermal Fatigue Life of Interstitial Via Hole in Printed Wiring Board (First Report, Investigation of Variation Factors of Life Using Thermal Cycling Test and Finite Element Analysis)

【2h】

Effect of Heterogeneity of Laminated Structure in FR-4 on Thermal Fatigue Life of Interstitial Via Hole in Printed Wiring Board (First Report, Investigation of Variation Factors of Life Using Thermal Cycling Test and Finite Element Analysis)

机译：层压结构在印刷布线间隙通孔孔的热疲劳寿命中的影响（第一次报告，使用热循环试验和有限元分析对寿命变异因子的调查）

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Kunihiro Takenaka; Qiang Yu;
展开▼
作者单位

展开▼
年度 2013
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
专利

1. Evaluation of Fatigue Life of Semiconductor Power Device by Power Cycle Test and Thermal Cycle Test Using Finite Element Analysis [J] . Kazunori Shinohara, Qiang Yu Engineering . 2010,第12期

机译：通过功率循环测试和热循环测试的有限元分析评估半导体功率器件的疲劳寿命
2. Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via [J] . Watanabe Kazuki, Kariya Yoshiharu, Yajima Naoyuki, Microelectronics & Reliability . 2018,第MARa期

机译：通孔过孔电镀铜薄膜的低周疲劳测试和热疲劳寿命预测
3. Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling [J] . Van Nhat Le, Benabou Lahouari, Etgens Victor, Microelectronics & Reliability . 2016,第OCTa期

机译：在热循环下过程产生的空隙对无铅焊点疲劳寿命影响的有限元分析
4. Effect of solder ball pitch and substrate material of printed wiring board on reliability under thermal cycling - a finite element analysis [C] . Khan S., Asaduzzaman M., Lamontia M.A., Electronic Components and Technology Conference, 2004. Proceedings. 54th . 2004

机译：焊球间距和印刷线路板基板材料对热循环可靠性的影响-有限元分析
5. Thermomechanical analysis and fatigue life prediction of plated-through-holes in multilayered printed wiring boards. [D] . Bhandarkar, Sarvotham M. 1992

机译：多层印刷线路板中镀通孔的热力学分析和疲劳寿命预测。
6. Evaluation of Fatigue Life of Semiconductor Power Device by Power Cycle Test and Thermal Cycle Test Using Finite Element Analysis [O] . Kazunori Shinohara, Qiang Yu 2010

机译：通过功率循环测试和热循环测试的有限元分析评估半导体功率器件的疲劳寿命

Effect of Heterogeneity of Laminated Structure in FR-4 on Thermal Fatigue Life of Interstitial Via Hole in Printed Wiring Board (First Report, Investigation of Variation Factors of Life Using Thermal Cycling Test and Finite Element Analysis)

著录项

引文网络

相似文献

相关主题

期刊订阅