COPLANARITY CORRECTING METHOD AND DEVICE OF SEALED SEMICONDUCTOR DEVICE LEAD

摘要

PROBLEM TO BE SOLVED: To enable the coplanarity correction of sealed semiconductor device to be performed stably regardless of the dispersion in the lead length of a sealed semiconductor device. ;SOLUTION: Within the method, the coplanarity of lead 9a is corrected by a method wherein a sealed semiconductor device 9 having the lead 9a externally extended from the side of a sealed body is mounted on a pedestal 8 so that the surface side of the device 9 may be clamped to make a pair of coplamarity corrected bodies 11, 12 with the lead 9a oppositely arranged alternately weld with each other. In such a constitution, the sealed semiconductor device 9 is mounted on the pedestal 8 with a backlash from the inner peripheral surface of the guide wall 8a in the outer periphery of the pedestal 9 as well as said device 9 is clapped with a backlash from the inner peripheral surface of the guide wall 10a in the outer periphery of the clamp 10.;COPYRIGHT: (C)1997,JPO