Microelectronic circuit struture and its manufacturing method

摘要

A microelectronic circuit structure has a semiconductor layer and a dielectric layer that are arranged neighboring one another. The dielectric layer comprises a charge distribution localized close to the boundary surface to the semiconductor layer which effects a shift of the local semiconductor surface potential in the semiconductor layer. The charge distribution, in particular, is non-uniform in the plane parallel to the boundary surface to the semiconductor layer so that the shift of the local semiconductor surface potential is effected in a limited region. Structures having dimensions down to 10 nm can thereby be produced by driving charge carriers into the dielectric layer in the electrical field between a pointed metal tip and the semiconductor layer.