INSPECTION METHOD FOR HEIGHT AND POSITION OF BALL OF BALL GRID ARRAY OR BUMP OF FLIP CHIP

摘要

PROBLEM TO BE SOLVED: To provide an inspection method in which the height and the position of tops of many balls or many bumps of a BGA or a flip chip are measured at extremely high speed and with high accuracy. ;SOLUTION: A reflection means (a prism 3) for an image is arranged on the side face of the ball 2 of a BGA 1 or the bump of a flip chip, the image on the side face of the ball 2 of the BGA 1 or the bump of the flip chip by the reflection means is input to a measuring means 4, the image is computed and processed by a computing device 5 while a virtual plane 10 and a reference line 11 on the virtual plane 10 are used as references, irregularities in the height and the position of the top of the ball 2 or the bump are detected, and whether the height and the position are good or not is judged.;COPYRIGHT: (C)1998,JPO