Inner lead bonding method of the TAB film carrier and TAB mounting semiconductor device

摘要

PURPOSE:To conduct a positioning operation in a short time with high precision by a method wherein a lead is arranged on only a pair of opposite sides to a larger hole than a semiconductor chip, the lead is not arranged on other opposite sides and the lead oriented in the different direction from the lead is arranged in an adjoining hole. CONSTITUTION:A lead 2a is formed on only a pair of opposite sides to a hole 1a of a TAB film 1, the lead is not formed on other opposite sides, and a lead 2b is formed in an adjoining hole on only a pair of opposite sides to the hole oriented in the perpendicular direction to the lead 2a, the lead is not formed on other opposite sides. Half the total bumps formed on the pair of opposite sides of a semiconductor chip and the lead 2a of the film 1 are positioned to perform inner-lead-bonding. The semiconductor chip cut off and separated the lead 2a from the film 1 is positioned in the hole 1a of the adjoining film 1 and the remaining half is positioned to perform the inner-lead-bonding. Thus, a positioning operation can be conducted in a short time with high precision.