SEMICONDUCTOR DEVICE, CHIP-MOUNTED TAPE CARRIER USED FOR MANUFACTURE OF SEMICONDUCTOR DEVICE, OUTER LEAD BONDING METHOD AND OUTER LEAD BONDER

摘要

PROBLEM TO BE SOLVED: To increase the strength of the connection of TAB leads with metal plate leads and to enhance the reliability of the connection of the TAB leads with the metal plate leads by a method wherein the thickness of the squeezed parts of the outer ends of the TAB leads is formed gradually thinner toward the outer ends of the TAB leads. SOLUTION: A plurality of Tape Automated Bonding(TAB) leads 20 are respectively pasted to the upper surface of each tape part 21 via each bonding agent 22. One end(inner end) of each TAB lead 20 is slightly made to protrude in a device hole, and at the same time, the other end (outer end) of the TAB lead 20 is made to protrude long from the outer periphery of each tape part 21. The outer end is connected with each metal plate lead 3 by thermocomposition bonding using a heat tool. The thickness of the squeezed parts 25 of the TAB leads 20 is formed thin along the directions of the outer ends of the TAB leads 20 by the thermocomposition bonding and the contact surface, which comes into contact with the squeezed parts 25, of the heat tool, that is, the pressure bonding force loading surfaces 24 of the parts 25 to the metal plate leads 3 are formed into a slant surface.