Fine pitch TAB/OLB (Tape Automated Bonding/Outer Lead Bonding) technology by soldering method through non-cleaning process

摘要

The developed technology made it possible to bond the outer leads of the TCP (Tape Carrier Package) at 0.15 mm pitch onto a substrate without a solder supply on the substrate electrodes, which reduces the substrate cost and simplifies the wiring pattern on the substrate, thereby decreasing the electronic noise due to the common electrode pattern for electro-plating. We studied the bonding conditions, materials, reliability and repair techniques, and we confirmed that the technology can be put into practical use.