A soldering iron includes a housing for accommodating therein at least one heating element and a soldering bit which is releasably secured to the housing. The heating element includes a heat-transmitting contact surface provided on an end face thereof which faces the soldering bit. A heat reception surface of said soldering bit is located opposite the contact surface and in direct contact therewith with no intermediate layer therebetween. A temperature sensor is located adjacent the contact surface and between the contact surface and a filament winding of the heating element.
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