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The use of mid-infrared lasers for drilling microvia holes in printed circuit (wiring) boards and other electrical circuit interconnection packages
The use of mid-infrared lasers for drilling microvia holes in printed circuit (wiring) boards and other electrical circuit interconnection packages
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机译:使用中红外激光在印刷电路板和其他电路互连套件中钻微孔
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摘要
This invention relates to using mid-infrared high-power pulsed laser radiation sources for drilling high-quality microvia interconnection holes in printed circuit (wiring) boards and other electrical circuit packages.
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