Process for controlling resin bleeding in integrated circuit packaging

摘要

A method for controlling resin bleeding on integrated circuit packages (125) is disclosed. Resin bleeding is controlled by lowering the surface energy of an IC substrate (110) to less than or about equal to the surface energy of an adhesive (130) which attaches IC units thereto. The IC substrate is treated with a material (150) that lowers its surface energy. The material layer forms a less wettable surface on the IC substrate which inhibits resin bleeding when the adhesive applied thereto is hardened. The material layer is formed from a solution of a polymer in a solvent. Suitable polymers include polyfluorinated hydrocarbon compounds.