Hybrid Packaging of Integrated Circuits for Engine Controls.

摘要

This report documents the design, test, and development of an advanced electronic packaging candidate for future, on-engine electronic controls. Materials with low and well-matched expansion properties, special processes, and special joining alloys were used because of the large number of thermal cycles expected. Tape-automated bonding was used because it offers improved reliability and lower production cost. Included in the program were temperature cycling, thermal shock, vibration bench testing, and on-engine environmental testing. The results obtained were favorable. (Author)