FORMATION OF BUMPS FOR FLIP-CHIP PACKAGE, BONDING TOOL AND FLIP-CHIP PACKAGE COMPONENT

摘要

PROBLEM TO BE SOLVED: To form pumps of the same height which are adapted for ultrasonic bonding by leaving the diameter portion of a bonding wire on the same electrode of either a flip-chip component or a board to a predetermined length, and by wedge-bonding two points on both sides of the diameter portion left on the electrode.;SOLUTION: A guide rail 28 is fixed to a table 26, and a flip-chip component 30 is positioned on the rail 28. Next, a welding surface of a tool 12 is positioned above an electrode 32 of the component 30 by moving either one or both of a horn 10 and the table 26. Under this condition, the horn 10 is lowered to thereby bias the welding surface of the tool 12 onto the electrode 32. At the same time, the horn 10 is vibrated by an ultrasonic vibration generator disposed at the root of the horn 10, thereby vibrating the welding surface of the tool 12. As a result, a wire 18 is vibrated together with the welding surface to thereby melt the surface of the electrode 32, and hence two points on the electrode 32 are wedge-bonded with the wire 18.;COPYRIGHT: (C)2000,JPO