PRINTED CIRCUIT BOARD, PRINTED WIRING BOARD AND MANUFACTURING COMPONENT TERMINALS

摘要

PROBLEM TO BE SOLVED: To avoid oxidating a conductive layer pattern and the surface of solder zones of component terminals to the pattern by forming an Ag-Pd film on the component terminals and the conductive layer pattern, except soldering connections of the conductive layer pattern on a printed wiring board.;SOLUTION: A surface-treated printed wiring board 3 and component terminals 5 are connected with solder to make a printed circuit board 10. The circuit board 10 has Ag-Pd films 30, 31 remaining on soldering connections 6 of the component terminals 5 and a soldering face 4 of a conductive pattern 2 such that the Ag-Pd films 30, 31 are applied to the component terminals 5 and the conductive layer pattern 2 surface, except solder bonding faces of the component terminals 5 and the conductive layer pattern 2 of the printed wiring board 3. This avoids oxidating the solder zone surfaces of the pattern 2 and the component terminals 5.;COPYRIGHT: (C)2000,JPO