A conductive refractory compound coating for electrodes is sputter resistant, very resistant to oxidation, and easy to apply by way of electrophoresis or screen printing. This structure is further enhanced by the presence of surface particles of electrically nonconductive ceramic material. when the cathode electrode is energized, electrically nonconductive material is penetrated by the electric field, which attracts secondary electrons out of the cathode electrode, thereby increasing the cathode's efficiency as an emitter of secondary electrons. More specifically, cathode electrodes are used in a plasma addressing structure. The coating is formed by approximately 5 nm particles, each comprised of a fused matrix of conductive and nonconductive particles co-deposited with frit particles by either electrophoresis or "silk" screening. The coating is subsequently baked to fuse the frit and bond the electrophoretically deposited particles to the electrodes.
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