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SPUTTER-RESISTANT LOW-WORK-FUNCTION CONDUCTIVE COATINGS FOR CATHODE ELECTRODES IN DC PLASMA ADDRESSING STRUCTURE
SPUTTER-RESISTANT LOW-WORK-FUNCTION CONDUCTIVE COATINGS FOR CATHODE ELECTRODES IN DC PLASMA ADDRESSING STRUCTURE
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机译:直流等离子寻址结构中阴极的抗杂散低功能导电涂层
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摘要
The high melting point compound coating 188 for the electrode has good sputter resistance and low work function and is a good emitter of secondary electrons and is highly resistant to oxidation and can be applied by electrophoresis It is easy. More specifically, the cathode electrode 162 is used in the plasma addressing structure 10. The coating is preferably formed by electrophoretic deposition of at least one high melting compound particle 184 along with the frit. The coating is then baked to allow the frit to melt and the particles deposited by electrophoresis adhere to the electrode.
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