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Sputter-resistant, low-work-function, conductive coatings for cathode electrodes in DC plasma addressing structure

机译:直流等离子体寻址结构中用于阴极的抗溅射,低功函数导电涂层

摘要

A refractory compound coating (188) for electrodes is sputter resistant, has a low work function so that it is a good emitter of secondary electrons, is very resistant to oxidation, and is easy to apply by way of electrophoresis. More specifically, cathode electrodes (162) are used in a plasma addressing structure (10). The coating is preferably formed by electrophoretic deposition of particles (184) of at least one refractory compound along with a frit. The coating is subsequently baked to fuse the frit and bond the electrophoretically deposited particles to the electrodes.
机译:用于电极的耐火化合物涂层(188)是耐溅射的,具有低的功函,因此它是良好的二次电子发射体,非常耐氧化,并且易于通过电泳施加。更具体地说,阴极(162)用于等离子体寻址结构(10)中。涂层优选通过电泳沉积至少一种耐火化合物的颗粒(184)以及玻璃料来形成。随后烘烤涂层以熔合玻璃料,并将电泳沉积的颗粒粘结到电极上。

著录项

  • 公开/公告号EP0762460A3

    专利类型

  • 公开/公告日1998-04-15

    原文格式PDF

  • 申请/专利权人 TEKTRONIX INC.;

    申请/专利号EP19960305962

  • 申请日1996-08-15

  • 分类号H01J17/06;H01J17/48;H01J9/02;

  • 国家 EP

  • 入库时间 2022-08-22 02:50:09

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