MANUFACTURING METHOD OF BGA TYPE SEMICONDUCTOR DEVICE, TAB TAPE FOR BGA SEMICONDUCTOR DEVICE, AND BGA TYPE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a BGA semiconductor device which can secure high reliability while being reduced in thickness and size. ;SOLUTION: A TAB tape 1 is preliminarily provided with U-shaped slits 1a, 1b and connections 1c, 1d which are so formed as to surround a semiconductor chip 3 mounting region, Within this region, a semiconductor chip 3 is pasted. Then, electrode pads 3a of the semiconductor chip 3 and the TAB tape 1-side ends of inner leads 5 are bonded and the bonded sections are molded with resin sealing material 6. On the rear face of the semiconductor chip 3 mounted face of the TAB tape 1, solder balls 8 are formed. Thereafter, a package section is cut out at the cutting positions 10 in the connections 1c, 1d of the slits 1a, 1b.;COPYRIGHT: (C)2000,JPO