LEADFRAME FEEDER OF AUTO MOLDING PRESS FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

The present invention relates to a lead frame feeder of an automatic molding press for manufacturing a semiconductor package, the guide rail to which the lead frame is transported in order to solve the problem that the operation efficiency is lowered and the merchandise is also reduced due to the occurrence of jams or scratches of the semiconductor material in the guide rail. And a pair of drive rollers installed at the lower part of the guide rail and rotated by driving of the motor, and installed at the upper part of the guide rail, and are positioned in line with the drive rollers to operate up and down by the action of a cylinder. A pair of feed rollers for feeding the lead frame to the end of the guide rail by moving in close contact with the drive roller, and the lead frame is installed on the upper end of the guide rail and transferred by the drive roller and the feed roller to drive the motor. Semiconductor comprising a pusher means for pushing the buffer Lead frame feeder of automatic molding press for the manufacture of semiconductor packages, which can facilitate the supply of semiconductor materials for the molding process of semiconductor packages by transferring materials to the buffer quickly and accurately without any damage.