PURPOSE: To provide a wafer inspecting apparatus capable of automatically adjusting at high accuracy the height of a probe needle to a bump pad formed on a wafer before inspecting the wafer, without any mark of the probe needle on the wafer. ;CONSTITUTION: The height of a probe needle 16 is detected by a CCD camera (needle height detecting means) 24, the upper end face of a bump pad 34 formed on the surface of a wafer 32 is detected by a laser length meter (electrode height detecting means) 28, and the results thereof are reported to a control unit 30. Based on these information, this unit 30 control layers moving mechanisms 11 and 12 to adequately contact the top end of the needle 16 to the pad 34 whereby in an electric characteristic inspecting step for the wafer 32 having the pad 34 the needle height adjustment to the pad 34 can be automatically made at high accuracy.;COPYRIGHT: (C)1996,JPO
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