首页> 外国专利> RESIST PEELING APPARATUS AND RESIST PEELING LIQUID MANAGEMENT METHOD, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME SEMICONDUCTOR

RESIST PEELING APPARATUS AND RESIST PEELING LIQUID MANAGEMENT METHOD, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME SEMICONDUCTOR

机译:电阻剥离装置和电阻剥离液体管理方法,以及半导体装置和制造相同半导体的方法

摘要

PROBLEM TO BE SOLVED: To maintain the element ratio of a resist peeling liquid to the adequate range for a long period of time in the resist for peeling resist residues adhered to a semiconductor wafer using a resist peeling liquid consisting of multiple elements.;SOLUTION: A peeling liquid tank 14 is provided to store the resist peeling liquid. A conductivity monitor 46 is provided to monitor the conductivity of the resist peeling liquid. An additional element tank 50 is also provided to estimate the element ratio of the resist peeling liquid based on such conductivity, and adds the adequate amount of resist peeling liquid based on the estimation result to cover the shortage of such resist peeling liquid.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:使用由多种元素组成的抗蚀剂剥离液将抗蚀剂剥离液中的元素比例长时间保持在适当的范围内,以剥离粘附在半导体晶片上的抗蚀剂残留物。设置有剥离液槽14以存储抗蚀剂剥离液。提供电导率监测器46以监测抗蚀剂剥离液的电导率。还提供了另外的元件罐50,以基于这种导电性来估计抗蚀剂剥离液的元素比率,并且基于估算结果添加适量的抗蚀剂剥离液以弥补这种抗蚀剂剥离液的不足。日本特许厅(C)2001

著录项

  • 公开/公告号JP2001223153A

    专利类型

  • 公开/公告日2001-08-17

    原文格式PDF

  • 申请/专利权人 MITSUBISHI ELECTRIC CORP;

    申请/专利号JP20000033789

  • 申请日2000-02-10

  • 分类号H01L21/027;G03F7/42;H01L21/304;H01L21/306;

  • 国家 JP

  • 入库时间 2022-08-22 01:31:55

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