TAPE CARRIER-TYPE SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD AND LIQUID CRYSTAL MODULE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To prevent a wiring pattern from being hollowed without the increase of cost even if an outer connection terminal part is gold-plated. SOLUTION: The wiring pattern 4 of a tape carrier 16 in COF 15 gold-plates 6 a part which is not filmed by solder resist 10. The inner lead 14 of the tape carrier 16 and the gold bump 3 of the electrode 2 of a semiconductor element 1 are heated and pressurized. Gold and gold are press-contacted and joined. The inner lead 14 is penetrated into the gold bump 3 so as to join them.