SOLDERING APPARATUS, SOLDERING METHOD, AND SURFACE MOUNTING TYPE BOARD BY THE METHOD

摘要

PROBLEM TO BE SOLVED: To obtain a soldering apparatus, a soldering method, and a surface mounting type board by this method, whereby soldering can be made stably, irrespective of the packing density of surface mounting type components. ;SOLUTION: An N- or Ar-contg. inert gas is jetted to blow off O adsorbed in the surface, an inert gas blowing hole 1 is disposed in a preheating tank 10 of a reflow apparatus to positively substitute O for the inert gas, and solder is molten in the absence of O in a reflowing tank 13 disposed downstream of the preheating tank 10.;COPYRIGHT: (C)2000,JPO