首页> 外国专利> METHOD FOR MANUFACTURING ANTENNA PATTERN FOR MEASURING PLASMA DAMAGE TO SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING ANTENNA PATTERN FOR MEASURING PLASMA DAMAGE TO SEMICONDUCTOR DEVICE

机译:制造用于测量等离子体对半导体器件的损伤的天线图案的方法

摘要

PURPOSE: A method for manufacturing an antenna pattern for measuring plasma damage to a semiconductor device is provided to test the semiconductor device in every manufacturing steps, by forming the antenna pattern which has a different circumference regarding the same area and a different area regarding the same circumference. CONSTITUTION: While a gate electrode and a device interconnection are formed to measure plasma damage to a semiconductor device, an antenna pattern is formed as the same material as the gate electrode and the device interconnection. The antenna pattern has various area ratios regarding the area of a gate electrode pattern and a device interconnection pattern. Either one of a circumference or area of the antenna pattern is varied.
机译:目的:提供一种用于制造用于测量对半导体器件的等离子体损伤的天线图案的方法,以通过形成相对于同一面积具有不同周长并且相对于同一面积具有不同面积的天线图案来在每个制造步骤中测试半导体器件。圆周。构成:在形成栅电极和器件互连以测量等离子体对半导体器件的损害的同时,以与栅电极和器件互连相同的材料形成天线图案。天线图案关于栅电极图案和器件互连图案的面积具有各种面积比。天线方向图的周长或面积之一改变。

著录项

  • 公开/公告号KR20010018454A

    专利类型

  • 公开/公告日2001-03-05

    原文格式PDF

  • 申请/专利权人 ANAM SEMICONDUCTOR. LTD.;

    申请/专利号KR19990034416

  • 发明设计人 LEE CHANG GI;

    申请日1999-08-19

  • 分类号H01L21/66;

  • 国家 KR

  • 入库时间 2022-08-22 01:14:04

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