Carrier frame structure for semiconductor package manufacturing

摘要

The present invention relates to a carrier frame structure for manufacturing a semiconductor package.;Conventionally, in using the carrier frame 10, the rectangular frame-shaped carrier frame 10 is easily deformed even by a small external force, since one side generally uses a rectangular frame-shaped carrier frame 10. There was a problem becoming.;Accordingly, the present invention devised a carrier frame 10 for manufacturing a micro BGA semiconductor package of a new type in view of the fact that the flexible film 1 attached to the carrier frame is formed in a roll shape and thus can be arbitrarily cut and used. In the present invention, by reinforcing means 20 in the middle of the carrier frame to prevent the bending deformation of the carrier frame to contribute to the improvement of the yield in the entire manufacturing process.