Device for Removing Photo Resist Layer On Wafer Edge

摘要

An object of the present invention is to provide a photosensitive film removing apparatus applied to a wafer that can prevent the photosensitive film applied to the wafer from being damaged by the thinner falling from the thinner nozzle.;The photosensitive film removing device applied to the wafer edge of the present invention is an apparatus for draining the thinner and the removed photosensitive film which are not dropped from the thinner nozzle by installing an exhaust line exhausted by a vacuum pump on the outside of the thinner nozzle.