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Achievement of Precise Edge Shapes of Silicon Wafers with Double-Layered Polishing Pads : Improvement of Edge Flatness Based on Static/Dynamic Model(Machine Elements, Design and Manufacturing)

机译：具有双层抛光垫的硅晶片精确边缘形状的成果：基于静态/动态模型的边缘平坦度改善（机器元件，设计和制造）

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Takahiro MIYAKE; Toshiyuki ENOMOTO; Norikazu TABATA;
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年度 2010
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6. Achievement of Highly Flat Edge with Double-Layered Polishing Pad (Improvement of Edge Flatness with Softening Upper Layer) [O] . Urara SATAKE, Toshiyuki ENOMOTO, Takahiro MIYAKE, 2012

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Achievement of Precise Edge Shapes of Silicon Wafers with Double-Layered Polishing Pads : Improvement of Edge Flatness Based on Static/Dynamic Model(Machine Elements, Design and Manufacturing)

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