DESIGN OF DISK/PAD CLEAN WITH WAFER AND WAFER EDGE/BEVEL CLEAN MODULE FOR CHEMICAL MECHANICAL POLISHING

摘要

Methods and apparatus are provided for cleaning a substrate after chemical mechanical planarization (CMP). The device includes a housing; A substrate holder rotatable on the first axis and configured to hold the substrate in a substantially vertical orientation; A first pad holder having a pad holding surface opposite to the substrate holder in a parallel and spaced relationship, the first pad holder being rotatable on a second axis parallel to the first axis; A first actuator operable to move the pad holder relative to the substrate holder to change a defined distance between the first axis and the second axis; And a second pad holder disposed in the housing, wherein the second pad holder has a pad holding surface opposite to the substrate holder in a parallel and spaced relationship, and the second pad holder is engaged with the rotary arm.