Electrostatic clamp for supporting dielectric wafer, has wafer contact electrode which contacts wafer to create electrical current path leading to wafer

摘要

A holding surface plane (115) is used for picking up a dielectric wafer. Holding electrodes (120) generate electrostatic force which allows energy admission against the holding surface plane. The electrically conducting surface of a wafer contact electrode (105) contacts the wafer, in order to create an electrical current path to the wafer. An Independent claim is also included for a dielectric wafer clamping method.