PURPOSE:To provide means for forming a high quality thin film, e.g. an oxide superconductive thin film or a dielectric thin film, by making uniform the temperature of a board being employed when a thin film is formed by sputtering, CVD, etc. CONSTITUTION:A board 5 for forming a thin film is placed tightly on a thermal conductive board 4 having thermal conductivity higher than that of the board 5. A thin film is then formed on the board 5 while heating the board 4 or both boards 4, 5. The thermal conductive board may be formed of sapphire, BN, or AlN. The thermal conductive board may have wider area than the thin film forming board. Both boards may be bonded through a thin silver film, a thin gold film, silver paste, or gold paste. This method allows formation of a silver oxide superconductive thin film, an oxide thin film, a dielectric thin film, etc.
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