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MEMBER FOR WIRING CIRCUIT AND ITS MANUFACTURING METHOD, MULTILAYER INTERCONNECTION CIRCUIT BOARD, AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
MEMBER FOR WIRING CIRCUIT AND ITS MANUFACTURING METHOD, MULTILAYER INTERCONNECTION CIRCUIT BOARD, AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
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机译:电路布线构件及其制造方法,多层互连电路板和半导体集成电路装置
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摘要
PROBLEM TO BE SOLVED: To improve reliability in continuity between the upper and lower wiring of a bump formed in a member for wiring circuits used for manufacturing a multilayer interconnection circuit board.;SOLUTION: On one main surface of a metal plate 1 made of metal foil that provides a plurality of metal bumps 3 where a vertical section is formed in a konide or trapezoidal shape at a specific position on the main surface, at least an insulating sheet 7 that is made of a synthetic resin and forms an interlayer insulating film thinner than the height of the metal bump 3, and first and second peeling sheets 8 and 9 are overlapped so that each metal bump 3 does not pass through those sheets. After that, the second peeling sheet 9 is peeled off, and the main surface of the metal plate is polished, thus eliminating a section for covering the metal bump 3 of the insulating sheet 7 so that the upper surface of the metal bump 3 is exposed by peeling off the first peeling sheet 8 for removing a foreign object 10.;COPYRIGHT: (C)2002,JPO
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