And a method of manufacturing the interconnection elements for interconnecting terminals exposed on the outer surface of the integrated circuit chip, and a method of manufacturing a multilayer interconnection board, including the interconnection of multiple elements, and a method for manufacturing a multilayer wiring board

摘要

Dielectric element having a second major surface and a first major surface and spaced from the first major surface and a plurality of recesses extending inwardly from the first major surface and a (4), interconnecting elements (2) provide. (6), is embedded (6a) plurality of metal traces in the plurality of recesses, the metal trace has an outer surface that is substantially flush with the first major surface, and an inner surface spaced from the outer surface. A plurality of posts (8) extends through the dielectric element (4) plurality of metal traces (6), from the inner surface of (6a), a plurality of posts having a top portion that is exposed at the second major surface. A multilayer wiring substrate including a (2) interconnecting a plurality of such elements (12), also provided with various methods for manufacturing a multilayer wiring board and interconnect such elements.