Structure of interconnection elements and multilayer wiring substrate including the interconnect element and manufacturing method

摘要

Dielectric element having a second major surface and a first major surface and spaced from the first major surface and a plurality of recesses extending inwardly from the first major surface and a (4), interconnecting elements (2) provide. (6), is embedded (6a) plurality of metal traces in the plurality of recesses, the metal trace has an outer surface that is substantially flush with the first major surface, and an inner surface spaced from the outer surface. A plurality of posts (8) extends through the dielectric element (4) plurality of metal traces (6), from the inner surface of (6a), a plurality of posts having a top portion that is exposed at the second major surface. A multilayer wiring substrate including a (2) interconnecting a plurality of such elements (12), also provided with various methods for manufacturing a multilayer wiring board and interconnect such elements.