Sn-Cu ALLOY PLATING BATH AND Sn-Cu ALLOY PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an Sn-Cu alloy plating bath which is a sulfuric acid bath consisting of sulfuric acid, a tin compound and a copper compound, and which enables the deposition of a dense Sn-Cu alloy plating film having good adhesion by electroplating.;SOLUTION: The Sn-Cu alloy plating film enables the deposition of an Sn-Cu alloy plating film which does not substantially contain lead on the object to be plated by electroplating. The plating bath is compounded with sulfuric acid, a tin compound, a copper compound and an N,N-bis(polyoxyethylene)alkylamine compound shown by the formula: CnH2n+1[(CH2CH2O)mH]2 (wherein, n=10, to 20, and m=2 to 10).;COPYRIGHT: (C)2002,JPO