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Plating bath and method of alloy including Sn-Cu and Articles coated by plating of alloy including Sn-Cu

机译:镀液和含锡铜合金的方法以及通过镀覆含锡铜合金的物品

摘要

For by tin anode (陽極) copper by silver alloy plating bath-soluble metal salt and a specific tin characterized in that it contains a sulfur-containing compound-copper alloy plating bath, tin-copper-bismuth alloy plating bath, or tin-copper this substitution is difficult to precipitate, a low current density dependence of the plating film composition, has good bath stability and can provide a plating bath containing a turbid hard tin and copper occur.
机译:用于由锡阳极(铜)镀银的铜合金中的可溶性金属盐和特定的锡,其特征在于,它包含含硫的化合物-铜-铜合金镀浴,锡-铜-铋合金镀浴或锡-铜这种取代难以沉淀,镀膜组合物的电流密度依赖性低,具有良好的镀液稳定性,并且可以提供含有混浊的硬锡和铜的镀液。

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