- - - Plating bath and method of alloy including Sn-Cu and Articles coated by plating of alloy including Sn-Cu

摘要

PURPOSE: A tin/copper containing plating bath that hardly gives rise to substitution deposition of copper onto a tin anode, has low dependence of a plating film composition on current density, and it is good in bath stability and hardly gives rise to clouding. CONSTITUTION: The tin/copper alloy plating bath, tin/copper/bismuth alloy plating bath or tin/copper/silver alloy plating bath respectively contain a soluble metal salt and a specific sulfurous compound.