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Failure analysis method for chip of ball grid array type semiconductor device
Failure analysis method for chip of ball grid array type semiconductor device
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机译:球栅阵列型半导体器件芯片的失效分析方法
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摘要
In a failure analysis method for a ball grid array type semiconductor device including a semiconductor chip having pads, first solder balls, an interposer substrate and second solder balls, the second solder balls and the interposer substrate are removed from the semiconductor device, and then, the first solder balls are removed from the semiconductor device. Then, the semiconductor device is mounted on a package, and a wire bonding operation is performed between the pads of the semiconductor chip and bonding pads of the package. Finally, a test operation is performed upon the semiconductor chip by mounting the package on a tester.
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