首页> 外国专利> Growing transition metal nitride thin films by using compound having hydrocarbon, amino or silyl group bound to nitrogen as nitrogen source material

Growing transition metal nitride thin films by using compound having hydrocarbon, amino or silyl group bound to nitrogen as nitrogen source material

机译:通过使用具有与氮键合的烃,氨基或甲硅烷基的化合物作为氮源材料,生长过渡金属氮化物薄膜

摘要

Transition metal nitride thin films are grown on substrate using alternate surface reactions of metal and nitrogen source materials. The nitrogen material is a compound with a hydrocarbon, amino or silyl group bound to nitrogen. The group generates a radical that serves as a reducing agent and/or reacts to generate atomic hydrogen when it dissociates in homolytically from nitrogen. An Independent claim is also included for a method of producing an electrically conductive diffusion barrier layer on a substrate comprising integrated circuits between a conductor and an isolation layer, comprising introducing the integrated circuit comprising conductors into the reaction space of an atomic layer deposition reactor, and growing a conductive metal nitride thin film on the integrated circuit using the inventive method.
机译:利用金属和氮源材料的交替表面反应,在衬底上生长过渡金属氮化物薄膜。氮材料是具有与氮结合的烃,氨基或甲硅烷基的化合物。该基团产生一个自由基,该自由基起还原剂的作用和/或当它与氮原子均相分解时反应生成氢原子。还包括关于在包括导体和隔离层之间的集成电路的衬底上制造导电扩散阻挡层的方法的独立权利要求,该方法包括将包括导体的集成电路引入原子层沉积反应器的反应空间中,以及使用本发明的方法在集成电路上生长导电金属氮化物薄膜。

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