DIRECT BONDING OF FLIP-CHIP LIGHT-EMITTING DIODE AND FLIP-CHIP ESD PROTECTION CHIP TO ELECTRODES IN A PACKAGE

摘要

PURPOSE: A light-emitting diode and its fabrication method are provided to eliminate completely wire bonds for high reliability, and reduce the manufacturing costs. CONSTITUTION: The LED(30) and the power shunting element(31) are flip-chips, having terminals on one surface. These terminals are directly bonded to pads(32,33) of the respective positive electrode(34) and negative electrode(35). The use of flip-chip bonding of both the LED(30) and the power shunting element(31) allows for the complete elimination of wire bonds from the assembly. The bonding may be by ultrasonic bonding, adhesive bonding, or soldering.