首页>
外国专利>
Direct bonding of flip-chip light-emitting diode and flip-chip ESD protection chip to electrodes in a package
Direct bonding of flip-chip light-emitting diode and flip-chip ESD protection chip to electrodes in a package
展开▼
机译:倒装芯片发光二极管和倒装芯片ESD保护芯片直接结合到封装中的电极上
展开▼
页面导航
摘要
著录项
相似文献
摘要
A light-emitting diode (LED) assembly incorporates a power shunting device that prevents damage to an LED due to electrostatic discharge (ESD). The power shunting device protects the LED by diverting electrical current from the LED and limiting the voltage across the LED to a certain voltage. In one embodiment, the LED and power shunting devices are flip-chips having terminals directly bonded to both the positive and negative electrodes, thus enhancing the reliability and ease of construction of the light-emitting diode assembly. A lens encapsulates the LED and optionally encapsulates the power shunting element.
展开▼