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Semiconductor wafer grinding pad, grinding manner of semiconductor wafer, grinding sheet for grinding pad, and foaming body block null for grinding sheet
Semiconductor wafer grinding pad, grinding manner of semiconductor wafer, grinding sheet for grinding pad, and foaming body block null for grinding sheet
PROBLEM TO BE SOLVED: To provide a polishing pad that has a fine pattern formed on a semiconductor wafer, is used for a polishing process for planarizing fine irregularities in the pattern, especially contains independent bubbles, and has a high polishing rate in polishing.;SOLUTION: In the semiconductor-polishing pad, whose polishing layer is an independent bubble type foam body made of resin, the number of independent bubbles in the polishing layer is set to 200/mm2 or larger and 600/mm2 or smaller, and at the same time, an average bubble diameter is set to 30 m or larger and 60 m or smaller.;COPYRIGHT: (C)2003,JPO
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机译：解决的问题：提供一种在半导体晶片上形成有精细图案的抛光垫，该抛光垫用于将图案中的精细凹凸平坦化的抛光工艺，特别是包含独立气泡，并且在抛光中具有高抛光速率。解决方案：在其抛光层是由树脂制成的独立气泡型泡沫体的半导体抛光垫中，抛光层中的独立气泡数设置为200 / mm 2 或更大且为600 / mm 2 或更小，同时将平均气泡直径设置为30 m或更大且60 m或更小。; COPYRIGHT：（C）2003，JPO
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