首页> 外文OA文献 >Material Removal Mechanism of Chemo-mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)

【2h】

Material Removal Mechanism of Chemo-mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)

机译：利用软磨料砂轮（saGW）去除si晶片化学机械研磨（CmG）的材料去除机理

页面导航

著录项
相似文献
相关主题

著录项

作者
D. M. Guo; Y. B. Tian; R. K. Kang; L. Zhou; M. K. Lei;
展开▼
作者单位

展开▼
年度 2016
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Material Removal Mechanism Of Chemo-mechanical Grinding (cmg) Of Si Wafer By Using Soft Abrasive Grinding Wheel (sagw) [J] . D.M. Guo, Y.B. Tian, R.K. Kang, Key Engineering Materials . 2009,第期

机译：使用软质砂轮（sagw）对硅片进行化学机械研磨（cmg）的材料去除机理
2. Effect of Wheel Additive On Chemo-Mechanical Grinding (CMG) of Single Crystal Si Wafer [J] . H. Takahashi, Y.B. Tian, Y. Mikami, Key Engineering Materials . 2010,第期

机译：砂轮添加剂对单晶硅晶片化学机械研磨（CMG）的影响
3. Analytical and experimental investigations into material removal mechanism of abrasive jet precision finishing with grinding wheel as restraint [J] . Changhe Li, Zhanrui Liu, Yali Hou, International Journal of Machining and Machinability of Materials . 2012,第3期

机译：以砂轮为约束的喷砂精加工材料去除机理的分析和实验研究
4. Material Removal Mechanism of Chemo-mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW) [C] . D. M. Guo, Y. B. Tian, R. K. Kang, International Symposium on Advances in Abrasive Technology . 2009

机译：Si晶片通过软研磨砂轮（SAGW）进行化学机械研磨（CMG）的材料去除机理
5. Material removal modeling and life expectancy of electroplated CBN grinding wheel and paired polishing. [D] . Yu, Tianyu. 2016

机译：电镀CBN砂轮和配对抛光的材料去除模型和预期寿命。
6. Research on Material Removal Mechanism of C/SiC Composites in Ultrasound Vibration-Assisted Grinding [O] . Dongpo Wang, Shouxiang Lu, Dong Xu, 2020

机译：超声振动辅助磨削中C / SiC复合材料去除材料机理的研究
7. Development of Porous Melamine-Bonded Wheel for Smooth and Mirrorlike Finish of Die Materials. In-Process Dressing Using Grinding Fluid with Abrasive Grains. [O] . Takuya SENBA, Shunji OMORI, Keizo SAKUMA, 1996

机译：多孔三聚氰胺粘结轮的开发，用于模具材料的光滑和镜面晶体。使用磨削颗粒的研磨液进行过程。
8. Dressing Methods for Grinding Wheels Made of Superhard Abrasive Materials [R] . Spur, G. 1983

机译：用超硬磨料制成的砂轮修整方法

Material Removal Mechanism of Chemo-mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)

著录项

相似文献

相关主题

期刊订阅